Invention Grant
- Patent Title: Method for producing a multilayer piezoelectric microcomponent using sacrificial thick film technology
- Patent Title (中): 使用牺牲厚膜技术生产多层压电微元件的方法
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Application No.: US12160179Application Date: 2007-01-05
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Publication No.: US08287943B2Publication Date: 2012-10-16
- Inventor: Claude Lucat , Francis Menil , Hélène Debeda-Hickel , Patrick Ginet
- Applicant: Claude Lucat , Francis Menil , Hélène Debeda-Hickel , Patrick Ginet
- Applicant Address: FR Paris
- Assignee: Centre National de la Recherche Scientifique
- Current Assignee: Centre National de la Recherche Scientifique
- Current Assignee Address: FR Paris
- Agency: Merchant & Gould
- Priority: FR0600124 20060106
- International Application: PCT/FR2007/000013 WO 20070105
- International Announcement: WO2007/077397 WO 20070712
- Main IPC: B05D5/12
- IPC: B05D5/12 ; H01L41/22 ; H01L21/00 ; H01L41/00 ; B32B3/00

Abstract:
The invention relates to the preparation of multilayer microcomponents which comprise one or more films, each consisting of a material M selected from metals, metal alloys, glasses, ceramics and glass-ceramics.The method consists in depositing on a substrate one or more films of an ink P, and one or more films of an ink M, each film being deposited in a predefined pattern selected according to the structure of the microcomponent, each film of ink P and each film of ink M being at least partially consolidated before deposition of the next film; effecting a total consolidation of the films of ink M partially consolidated after their deposition, to convert them to films of material M; totally or partially removing the material of each of the films of ink P. An ink P consists of a thermoset resin containing a mineral filler or a mixture comprising a mineral filler and an organic binder. An ink M consists of a mineral material precursor of the material M and an organic binder. The inks are deposited by pouring or by extrusion.
Public/Granted literature
- US20090197061A1 PRODUCTION OF A MATERIAL MULTILAYER MICROCOMPONENTS BY THE SACRIFICIAL THICK LAYER METHOD SACRIFICIELLE Public/Granted day:2009-08-06
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