Invention Grant
US08287996B2 Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
有权
用于微电子器件的涂层，包括其的处理以及管理微电子管芯的热分布的方法
- Patent Title: Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
- Patent Title (中): 用于微电子器件的涂层，包括其的处理以及管理微电子管芯的热分布的方法
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Application No.: US12653791Application Date: 2009-12-21
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Publication No.: US08287996B2Publication Date: 2012-10-16
- Inventor: Dingying Xu , Leonel R. Arana , Nachiket R. Raravikar , Mohit Mamodia , Rajasekaran Swaminathan , Rahul Manepalli
- Applicant: Dingying Xu , Leonel R. Arana , Nachiket R. Raravikar , Mohit Mamodia , Rajasekaran Swaminathan , Rahul Manepalli
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Kenneth A. Nelson
- Main IPC: B32B27/32
- IPC: B32B27/32
Abstract:
A coating for a microelectronic device comprises a polymer film (131) containing a filler material (232). The polymer film has a thermal conductivity greater than 3 W/m·K and a thickness (133) that does not exceed 10 micrometers. The polymer film may be combined with a dicing tape (310) to form a treatment (300) that simplifies a manufacturing process for a microelectronic package (100) and may be used in order to manage a thermal profile of the microelectronic device.
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