Invention Grant
US08288302B2 Method of preparing substrates—molecular sieve layers complex using ultrasound and apparatuses used therein
有权
使用超声波制备底物 - 分子筛层复合物的方法及其中使用的装置
- Patent Title: Method of preparing substrates—molecular sieve layers complex using ultrasound and apparatuses used therein
- Patent Title (中): 使用超声波制备底物 - 分子筛层复合物的方法及其中使用的装置
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Application No.: US11629375Application Date: 2005-06-23
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Publication No.: US08288302B2Publication Date: 2012-10-16
- Inventor: Kyung Byung Yoon , Jin Seok Lee , Kwang Ha , Yun-Jo Lee , Yong Chang
- Applicant: Kyung Byung Yoon , Jin Seok Lee , Kwang Ha , Yun-Jo Lee , Yong Chang
- Applicant Address: KR Seoul
- Assignee: Industry University Cooperation Foundation Sogang University
- Current Assignee: Industry University Cooperation Foundation Sogang University
- Current Assignee Address: KR Seoul
- Agency: Frommer Lawrence & Haug LLP
- Agent Ronald R. Santucci
- Priority: KR10-2004-0047287 20040623; KR10-2004-0051254 20040701
- International Application: PCT/KR2005/001960 WO 20050623
- International Announcement: WO2006/001648 WO 20060105
- Main IPC: B01J29/06
- IPC: B01J29/06

Abstract:
The present invention relates to a method for preparing substrate-molecular sieve layer complex by vising ultra-sound and apparatuses used therein, more particularly to a method for preparing substrate-molecular sieve layer complex by combining substrate, coupling compound and molecular sieve particle, wherein covalent, ionic, coordinate or hydrogen bond between a substrate and a coupling compound; molecular sieve particle and coupling compound; coupling compounds; coupling compound and intermediate coupling compound is induced by using 15 KHz-100 MHz of ultrasound instead of simple reflux to combine substrate and molecular sieve particles by various processes, further to reduce time and energy, to retain high binding velocity, binding strength, binding intensity and density remarkably, to attach molecular sieve particle uniformly onto all substrates combined with coupling compound selectively, even though substrate with coupling compound and substrate without coupling compound exist together; and apparatuses installed therein, which can improve to produce substrate-molecular sieve layer complex in a large scale.
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