Invention Grant
- Patent Title: Flexible wiring board, manufacturing method thereof and flexible wiring device
- Patent Title (中): 柔性布线板及其制造方法和柔性布线装置
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Application No.: US12644723Application Date: 2009-12-22
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Publication No.: US08290326B2Publication Date: 2012-10-16
- Inventor: Hideto Furuyama , Hiroshi Uemura
- Applicant: Hideto Furuyama , Hiroshi Uemura
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Turocy & Watson, LLP
- Priority: JP2009-213622 20090915
- Main IPC: G02B6/10
- IPC: G02B6/10

Abstract:
A flexible wiring board including a pair of end regions provided in portions of a flexible wiring board on which a plurality of wires are arranged in parallel in one direction and disposed separately in a wiring lengthwise direction, a wiring region configured in another portion of the wiring board and sandwiched between the end regions, a plurality of flexible wiring fins which is divided by at least one slit that connects the end regions in the wiring region, and a flexible wiring bundle by bundling at least part of the plurality of flexible wiring fins.
Public/Granted literature
- US20110064369A1 FLEXIBLE WIRING BOARD, MANUFACTURING METHOD THEREOF AND FLEXIBLE WIRING DEVICE Public/Granted day:2011-03-17
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