Invention Grant
- Patent Title: Conductive lubricant composition
- Patent Title (中): 导电润滑剂组合物
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Application No.: US10551238Application Date: 2004-04-02
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Publication No.: US08293693B2Publication Date: 2012-10-23
- Inventor: Hideto Kamimura , Tatsuya Egawa
- Applicant: Hideto Kamimura , Tatsuya Egawa
- Applicant Address: JP Tokyo
- Assignee: Idemitsu Kosan Co., Ltd.
- Current Assignee: Idemitsu Kosan Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2003-099652 20030402
- International Application: PCT/JP2004/004852 WO 20040402
- International Announcement: WO2004/090082 WO 20041021
- Main IPC: C10M133/16
- IPC: C10M133/16 ; C10M105/18 ; C10M125/24

Abstract:
The present invention provides a conductive lubricant composition, characterized in that the composition contains a lubricating base oil (A) other than a silicone oil, and a non-metallic antistatic agent (B), and exhibits a kinematic viscosity of 25 mm2/s or less at 40° C., a viscosity index of 100 or higher, a flash point of 150° C. or higher, and a volume resistivity of 1×1010Ω·cm or less at 25° C.The invention also provides a bearing oil formed from the lubricant composition.
Public/Granted literature
- US20060199747A1 Conductive lubricant composition Public/Granted day:2006-09-07
Information query
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