Invention Grant
US08294031B2 Solder resist coating for rigid-flex circuit boards and method of producing the solder resist coating
有权
用于刚性 - 柔性电路板的防焊涂层和制造阻焊涂层的方法
- Patent Title: Solder resist coating for rigid-flex circuit boards and method of producing the solder resist coating
- Patent Title (中): 用于刚性 - 柔性电路板的防焊涂层和制造阻焊涂层的方法
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Application No.: US12697407Application Date: 2010-02-01
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Publication No.: US08294031B2Publication Date: 2012-10-23
- Inventor: Detlev Bagung , Michael Decker , Gregory Drew , Thomas Riepl , Bernd Roller
- Applicant: Detlev Bagung , Michael Decker , Gregory Drew , Thomas Riepl , Bernd Roller
- Applicant Address: DE Hannover
- Assignee: Continental Automotive GmbH
- Current Assignee: Continental Automotive GmbH
- Current Assignee Address: DE Hannover
- Agent Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- Priority: DE102009006757 20090130
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
A solder resist coating for a rigid-flex circuit board contains one or more conductor tracks and at least one flex area. The solder resist coating has one or more movement gaps in the flex area of the circuit board. In addition, an electronic module is formed having at least one rigid-flex circuit board with a solder resist coating.
Public/Granted literature
- US20100193223A1 SOLDER RESIST COATING FOR RIGID-FLEX CIRCUIT BOARDS AND METHOD OF PRODUCING THE SOLDER RESIST COATING Public/Granted day:2010-08-05
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