Invention Grant
- Patent Title: Semiconductor device for improving electrical and mechanical connectivity of conductive pillers and method therefor
- Patent Title (中): 用于改善导电块的电气和机械连接性的半导体器件及其方法
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Application No.: US12751842Application Date: 2010-03-31
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Publication No.: US08294265B1Publication Date: 2012-10-23
- Inventor: Kwang Sun Oh , Dong Hee Lee , Dong In Kim , Bae Yong Kim , Jin Woo Park
- Applicant: Kwang Sun Oh , Dong Hee Lee , Dong In Kim , Bae Yong Kim , Jin Woo Park
- Applicant Address: US AZ Chandler
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Chandler
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52
Abstract:
A semiconductor device has a semiconductor die having a first surface and a second surface wherein at least one bond pad is formed on the first surface. A passivation layer is formed on the first surface of the semiconductor device, wherein a central area of the at least one bond is exposed. A seed layer is formed on exposed portions of the bond pad and the passivation layer. A conductive pillar is formed on the seed layer. The conductive pillar has a base portion wherein the base portion has a diameter smaller than the seed layer and a stress relief portion extending from a lateral surface of a lower section of the base portion toward distal ends of the seed layer. A solder layer is formed on the conductive pillar.
Information query
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