Invention Grant
- Patent Title: Chip package with dam bar restricting flow of underfill
- Patent Title (中): 具有坝条的芯片封装限制底部填充物的流动
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Application No.: US11307127Application Date: 2006-01-24
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Publication No.: US08294279B2Publication Date: 2012-10-23
- Inventor: Ke-Hung Chen , Shih-Hsiung Lin , Mou-Shiung Lin
- Applicant: Ke-Hung Chen , Shih-Hsiung Lin , Mou-Shiung Lin
- Applicant Address: TW Hsinchu
- Assignee: Megica Corporation
- Current Assignee: Megica Corporation
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material.
Public/Granted literature
- US20060220259A1 MULTI-CHIP STRUCTURE AND METHOD OF ASSEMBLING CHIPS Public/Granted day:2006-10-05
Information query
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