Invention Grant
US08294531B2 Microstrip line provided with conductor section having groove formed to sterically intersect strip conductor
有权
带有导体部分的微带线，其具有形成为与带状导体空间相交的凹槽
- Patent Title: Microstrip line provided with conductor section having groove formed to sterically intersect strip conductor
- Patent Title (中): 带有导体部分的微带线，其具有形成为与带状导体空间相交的凹槽
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Application No.: US12664431Application Date: 2009-02-24
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Publication No.: US08294531B2Publication Date: 2012-10-23
- Inventor: Kazuyuki Sakiyama , Akira Minegishi
- Applicant: Kazuyuki Sakiyama , Akira Minegishi
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2008-104557 20080414
- International Application: PCT/JP2009/000795 WO 20090224
- International Announcement: WO2009/128193 WO 20091022
- Main IPC: H01P3/08
- IPC: H01P3/08
Abstract:
A microstrip line is constituted by including a grounding conductor and a strip conductor with a dielectric substrate being sandwiched between the grounding conductor and the strip conductor. The microstrip line includes a conductor section having at least one groove formed to sterically intersect the strip conductor, thereby exhibiting a substantially more uniform passing characteristic as compared with a prior art microstrip line.
Public/Granted literature
- US20100171574A1 MICROSTRIP LINE Public/Granted day:2010-07-08
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