Invention Grant
US08299369B2 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
有权
电源 - 接地平面分区和通孔连接，以利用通道/沟槽进行电力输送
- Patent Title: Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
- Patent Title (中): 电源 - 接地平面分区和通孔连接，以利用通道/沟槽进行电力输送
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Application No.: US12605198Application Date: 2009-10-23
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Publication No.: US08299369B2Publication Date: 2012-10-30
- Inventor: Gary A. Brist , Gary Baxter Long , Daryl A. Sato
- Applicant: Gary A. Brist , Gary Baxter Long , Daryl A. Sato
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes.
Public/Granted literature
- US20100038127A1 Power-Ground Plane Partitioning and Via Connection to Utilize Channel/Trenches for Power Delivery Public/Granted day:2010-02-18
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