Invention Grant
- Patent Title: Semiconductor structures having improved contact resistance
- Patent Title (中): 具有改善的接触电阻的半导体结构
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Application No.: US11872291Application Date: 2007-10-15
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Publication No.: US08299455B2Publication Date: 2012-10-30
- Inventor: Bruce B. Doris , Carl J. Radens , Anthony K. Stamper , Jay W. Strane
- Applicant: Bruce B. Doris , Carl J. Radens , Anthony K. Stamper , Jay W. Strane
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Katherine S. Brown, Esq.
- Main IPC: H01L29/06
- IPC: H01L29/06

Abstract:
Self-assembled polymer technology is used to form at least one ordered nanosized pattern within material that is present in a conductive contact region of a semiconductor structure. The material having the ordered, nanosized pattern is a conductive material of an interconnect structure or semiconductor source and drain diffusion regions of a field effect transistor. The presence of the ordered, nanosized pattern material within the contact region increases the overall area (i.e., interface area) for subsequent contact formation which, in turn, reduces the contact resistance of the structure. The reduction in contact resistance in turn improves the flow of current through the structure. In addition to the above, the inventive methods and structures do not affect the junction capacitance of the structure since the junction area remains unchanged.
Public/Granted literature
- US20120132966A1 SEMICONDUCTOR STRUCTURES HAVING IMPROVED CONTACT RESISTANCE Public/Granted day:2012-05-31
Information query
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