Invention Grant
- Patent Title: Inductively coupled module and item with inductively coupled module
- Patent Title (中): 电感耦合模块和电感耦合模块
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Application No.: US12398497Application Date: 2009-03-05
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Publication No.: US08299929B2Publication Date: 2012-10-30
- Inventor: Noboru Kato , Tsuneo Murata
- Applicant: Noboru Kato , Tsuneo Murata
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2006-261010 20060926
- Main IPC: G08B13/14
- IPC: G08B13/14

Abstract:
An inductively coupled module includes a wireless IC chip and a feeder circuit substrate which is connected to the wireless IC chip and which includes a feeder circuit including an inductance element and a capacitance element. The feeder circuit substrate is made of a biodegradable plastic so as to prevent a negative impact of the module on the environment and the human body. The inductively coupled module is adhered on a radiation plate and is used as a wireless IC device of an RFID system.
Public/Granted literature
- US20090160619A1 INDUCTIVELY COUPLED MODULE AND ITEM WITH INDUCTIVELY COUPLED MODULE Public/Granted day:2009-06-25
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