Invention Grant
- Patent Title: MEMS devices with multi-component sacrificial layers
- Patent Title (中): 具有多组分牺牲层的MEMS器件
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Application No.: US13098292Application Date: 2011-04-29
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Publication No.: US08300299B2Publication Date: 2012-10-30
- Inventor: Ming-Hau Tung , Lior Kogut
- Applicant: Ming-Hau Tung , Lior Kogut
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: G02B26/00
- IPC: G02B26/00 ; H01L21/311

Abstract:
Methods of forming a protective coating on one or more surfaces of a microelectromechanical device are disclosed comprising the steps of forming a composite layer of a sacrificial material and a protective material, and selectively etching the sacrificial material to form a protective coating. The protective coatings of the invention preferably improve one or more aspects of the performance of the microelectromechanical devices in which they are incorporated. Also disclosed are microelectromechanical devices formed by methods of the invention, and visual display devices incorporating such devices.
Public/Granted literature
- US20110205615A1 MEMS DEVICES WITH MULTI-COMPONENT SACRIFICIAL LAYERS Public/Granted day:2011-08-25
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