Invention Grant
- Patent Title: Wiring structure of flexure
- Patent Title (中): 挠性接线结构
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Application No.: US13225193Application Date: 2011-09-02
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Publication No.: US08300363B2Publication Date: 2012-10-30
- Inventor: Hajime Arai , Kiyotaka Fukushima
- Applicant: Hajime Arai , Kiyotaka Fukushima
- Applicant Address: JP Kanagawa
- Assignee: NHK Spring Co., Ltd.
- Current Assignee: NHK Spring Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: Jordan and Hamburg LLP
- Priority: JP2010-223834 20101001
- Main IPC: G11B5/60
- IPC: G11B5/60

Abstract:
A wiring structure of a flexure includes wiring that includes a trace of first polarity and a trace of second polarity and transmits signals to and from a head that is supported with the flexure and writes and reads data to and from a recording medium and an interleaved section formed at least partly in the wiring where the traces are each divided into sub-traces, the sub-traces being alternated in a width direction of the wiring, the sub-traces of each trace being connected to each other on each side of the interleaved section, an outer one of the sub-traces of each trace being narrower than an inner one of the same. The wiring structure reduces partial dips in the frequency characteristic of signal transmission loss (loss-to-frequency characteristic) of the wiring at the interleaved section.
Public/Granted literature
- US20120081815A1 WIRING STRUCTURE OF FLEXURE Public/Granted day:2012-04-05
Information query
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