Invention Grant
- Patent Title: Thermoacoustic module, thermoacoustic device, and method for making the same
- Patent Title (中): 热声模块，热声装置及其制作方法
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Application No.: US12655415Application Date: 2009-12-30
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Publication No.: US08300855B2Publication Date: 2012-10-30
- Inventor: Liang Liu , Li Qian , Chen Feng
- Applicant: Liang Liu , Li Qian , Chen Feng
- Applicant Address: CN Beijing
- Assignee: Beijing FUNATE Innovation Technology Co., Ltd.
- Current Assignee: Beijing FUNATE Innovation Technology Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Altis Law Group, Inc.
- Priority: CN200810191731 20081230; CN200810191732 20081230; CN200810191739 20081230; CN200810191740 20081230; CN200910000260 20090115; CN200910000261 20090115; CN200910000262 20090115
- Main IPC: H04R25/00
- IPC: H04R25/00
Abstract:
A thermoacoustic module includes a substrate, a sound wave generator, at least one first electrode and at least one second electrode. The substrate has a top surface, and the top surface defines at least one recess. The sound wave generator is located on the top surface of the substrate and includes at least one first region suspended above the at least one recess and at least one second region being in contact with the top surface of the substrate. The at least one first electrode and at least one second electrode are coupled to the sound wave generator.
Public/Granted literature
- US20100166232A1 Thermoacoustic module, thermoacoustic device, and method for making the same Public/Granted day:2010-07-01
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