Invention Grant
- Patent Title: Method of making a sensing unit
- Patent Title (中): 制作感测单元的方法
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Application No.: US12659337Application Date: 2010-03-04
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Publication No.: US08302285B2Publication Date: 2012-11-06
- Inventor: Yoshitaka Sasaki , Tatsushi Shimizu , Takehiro Horinaka , Kazuo Ishizaki , Shigeki Tanemura
- Applicant: Yoshitaka Sasaki , Tatsushi Shimizu , Takehiro Horinaka , Kazuo Ishizaki , Shigeki Tanemura
- Applicant Address: unknown Milpitas CN Hong Kong
- Assignee: Headway Technologies, Inc.,SAE Magnetics (H.K.) Ltd.
- Current Assignee: Headway Technologies, Inc.,SAE Magnetics (H.K.) Ltd.
- Current Assignee Address: unknown Milpitas CN Hong Kong
- Agency: Oliff & Berridge, PLC
- Main IPC: G01R3/00
- IPC: G01R3/00

Abstract:
In a sensing unit according to the present invention, a spring portion having a support portion and a movable portion is conductive. A signal of a sensor portion provided on the movable portion of the spring portion is transmitted via the spring portion. Hence, the sensing unit according to the present invention has a simple constitution with a small number of components, and a wire does not necessarily have to be provided for each sensor portion. As a result, a reduction in manufacturing cost, simplification of the manufacturing process, and so on are achieved.
Public/Granted literature
- US08230577B2 Method of making a sensing unit Public/Granted day:2012-07-31
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