Invention Grant
- Patent Title: Component mounting system
- Patent Title (中): 组件安装系统
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Application No.: US13101596Application Date: 2011-05-05
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Publication No.: US08302291B2Publication Date: 2012-11-06
- Inventor: Hiroyuki Ao , Tomohiko Hattori
- Applicant: Hiroyuki Ao , Tomohiko Hattori
- Applicant Address: JP Chiryu-shi
- Assignee: Fuji Machine Mfg. Co., Ltd.
- Current Assignee: Fuji Machine Mfg. Co., Ltd.
- Current Assignee Address: JP Chiryu-shi
- Agency: Foley & Lardner LLP
- Priority: JP2010-116793 20100520
- Main IPC: B23P19/00
- IPC: B23P19/00

Abstract:
A component mounting system including mounting machines along a direction of conveying a circuit board; a feeder mount base in each of the mounting machines; a feeder removably mounted on the feeder mount base of each of the mounting machines; a mounting head in each of the mounting machines, the mounting head sucking a component supplied from the feeder for mounting on the circuit board; a moving mechanism in each of the mounting machines, the moving mechanism configured to removably mount and move the mounting head; an inspection camera unit configured to image an inspection target part of the circuit board; and an inspection image processing unit mounted, replaceably with the feeder, on the feeder mount base where the inspection camera unit is mounted, the inspection image processing unit processing an image signal output from the inspection camera unit to inspect the inspection target part.
Public/Granted literature
- US20110283530A1 COMPONENT MOUNTING SYSTEM Public/Granted day:2011-11-24
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