Invention Grant
- Patent Title: Thermal conductivity sensor
- Patent Title (中): 导热系数传感器
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Application No.: US12726923Application Date: 2010-03-18
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Publication No.: US08302459B2Publication Date: 2012-11-06
- Inventor: Makoto Matsuhama , Tomoko Seko , Shuji Takada , Hiroshi Mizutani , Takuji Oida , Masahiko Endo , Takuya Ido
- Applicant: Makoto Matsuhama , Tomoko Seko , Shuji Takada , Hiroshi Mizutani , Takuji Oida , Masahiko Endo , Takuya Ido
- Applicant Address: JP Kyoto-shi
- Assignee: HORIBA, Ltd.
- Current Assignee: HORIBA, Ltd.
- Current Assignee Address: JP Kyoto-shi
- Agency: Alleman Hall McCoy Russell & Tuttle LLP
- Priority: JP2009-080519 20090327; JP2009-080520 20090327
- Main IPC: G01N30/66
- IPC: G01N30/66 ; G01N27/18

Abstract:
The measurement sensitivity is improved by suppressing the surrounding temperature influence as much as possible, while realizing scale reduction, and by enlarging the detection signal, while reducing the production errors in enclosing a reference gas. Provided is a thermal conductivity sensor that detects thermal conductivity of a sample gas by using a Wheatstone Bridge circuit constructed in such a manner that measurement resistors that are brought into contact with the sample gas are disposed on a first side, and reference resistors that are brought into contact with a reference gas are disposed on a second side, and comparing the potential difference between connection points of the reference resistors and the measurement resistors. The measurement resistors disposed on the first side are assembled in one measurement space, and the reference resistors disposed on the second side are assembled in one reference space.
Public/Granted literature
- US20100242573A1 THERMAL CONDUCTIVITY SENSOR Public/Granted day:2010-09-30
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