Invention Grant
- Patent Title: Stripping device and stripping method
- Patent Title (中): 剥离装置和剥离方法
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Application No.: US13093412Application Date: 2011-04-25
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Publication No.: US08302651B2Publication Date: 2012-11-06
- Inventor: Kimihiro Nakada , Yasumasa Iwata , Akihiko Nakamura , Yoshihiro Inao , Satoshi Kobari
- Applicant: Kimihiro Nakada , Yasumasa Iwata , Akihiko Nakamura , Yoshihiro Inao , Satoshi Kobari
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2010-102066 20100427; JP2010-102081 20100427
- Main IPC: B29C63/00
- IPC: B29C63/00
Abstract:
A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.
Public/Granted literature
- US20110259527A1 STRIPPING DEVICE AND STRIPPING METHOD Public/Granted day:2011-10-27
Information query
