The method for bonding a glass cap according to the present invention comprises the steps of, forming a plurality of recesses on a side of a glass corresponding to a substrate; forming a plurality of light non-transmittable layers on a surface of the glass opposite to a surface corresponding to the substrate; dispensing a sealant on a substrate-bonding region of the glass or on a cap-bonding region of the substrate; bonding the glass to the substrate in the state that each active area formed on the substrate is received in each recess of the glass; curing the sealant dispensed on the sealing-dispensing region by irradiating ultraviolet rays to a side of the glass to which the substrate is not bonded; and dicing the bonded glass and substrate to make the individual devices. The present invention intercepts the ultraviolet rays irradiated to the active areas of the substrate to protect the active areas, and so can cure completely the sealant dispensed on the metal lines.