Invention Grant
- Patent Title: Photosensitive resin composition and circuit formation substrate using the same
- Patent Title (中): 感光树脂组合物和使用其的电路形成基材
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Application No.: US12759475Application Date: 2010-04-13
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Publication No.: US08304160B2Publication Date: 2012-11-06
- Inventor: Tomonori Minegishi , Rika Nogita , Dai Kawasaki , Keiko Suzuki , Taku Konno
- Applicant: Tomonori Minegishi , Rika Nogita , Dai Kawasaki , Keiko Suzuki , Taku Konno
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Dupont Microsystems, Ltd.
- Current Assignee: Hitachi Chemical Dupont Microsystems, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Griffin & Szipl, P.C.
- Priority: JP2009-097918 20090414; JP2009-286479 20091217
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/004 ; G03F7/40
Abstract:
A photosensitive resin composition for an interlayer insulating film or a protective film of a substrate for circuit formation, which includes a polymer (a) having a structural unit shown by the formula (A) and a compound (b) which generates a radical when irradiated with active rays and has a structure shown by the following formula (B).
Public/Granted literature
- US20100260983A1 PHOTOSENSITIVE RESIN COMPOSITION AND CIRCUIT FORMATION SUBSTRATE USING THE SAME Public/Granted day:2010-10-14
Information query
