Invention Grant
- Patent Title: Integrated circuit packaging system with shielded package and method of manufacture thereof
- Patent Title (中): 具有屏蔽封装的集成电路封装系统及其制造方法
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Application No.: US12636703Application Date: 2009-12-11
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Publication No.: US08304286B2Publication Date: 2012-11-06
- Inventor: Reza Argenty Pagaila , Dioscoro A. Merilo , Shuangwu Huang
- Applicant: Reza Argenty Pagaila , Dioscoro A. Merilo , Shuangwu Huang
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent Mikio Ishimaru; Stanley M. Chang
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L21/44 ; H01L23/02 ; H01L23/552 ; H01L23/52
Abstract:
A method of manufacture of an integrated circuit packaging system includes: providing a substrate assembly having a connection path; mounting a base device over the substrate assembly with a mount layer; mounting a stack device over the base device and having a stack die and a stack-organic-material; forming a stack-through-via in the stack-organic-material of the stack device and connected to the stack die and the substrate assembly; and applying a shield layer directly on a planarized surface of the stack-through-via partially exposed from the stack-organic-material.
Public/Granted literature
- US20110140247A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDED PACKAGE AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2011-06-16
Information query
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