Invention Grant
US08304337B2 Integrated circuit packaging system with bond wire pads and method of manufacture thereof
有权
具有接合线焊盘的集成电路封装系统及其制造方法
- Patent Title: Integrated circuit packaging system with bond wire pads and method of manufacture thereof
- Patent Title (中): 具有接合线焊盘的集成电路封装系统及其制造方法
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Application No.: US12637746Application Date: 2009-12-14
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Publication No.: US08304337B2Publication Date: 2012-11-06
- Inventor: Henry Descalzo Bathan , Jairus Legaspi Pisigan , Zigmund Ramirez Camacho
- Applicant: Henry Descalzo Bathan , Jairus Legaspi Pisigan , Zigmund Ramirez Camacho
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent Mikio Ishimaru; Stanley M. Chang
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L29/40
Abstract:
A method of manufacture of an integrated circuit packaging system includes: forming a device over a substrate including a bond wire pad row located between a perimeter of the substrate and the device; configuring the bond wire pad row to include three sided bond wire pads that horizontally overlap; and forming an interconnection between the device and the bond wire pad row.
Public/Granted literature
- US20110140287A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BOND WIRE PADS AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2011-06-16
Information query
IPC分类:
