A method for producing a conductive polyamide-polyphenylene ether resin composition comprising (A) 10 to 90 parts by mass of a polyphenylene ether resin, (B) 5 to 85 parts by mass of a polyamide having a (terminal amino group)/(terminal carboxyl group) ratio falling within the range from 0.20 to 4.0, (C) 5 to 85 parts by mass of a polyamide having a (terminal amino group)/(terminal carboxyl group) ratio falling within the range from 0.05 to 0.19 and (D) 0.1 to 10 parts by mass of a conductive filler, the method comprising the step of melt-kneading of the component (A), the component (B), a compatibilizer (F) and a master batch (E) obtained by melt-kneading of the component (D) and the component (C) in advance.