A fully reflective and highly thermoconductive electronic module includes a metal bottom layer, a transparent ceramic layer and a patterned metal wiring layer. The metal bottom layer has a lower reflective surface. The transparent ceramic layer has an upper surface and a lower surface. The lower surface of the transparent ceramic layer is bonded to the lower reflective surface of the metal bottom layer. The metal wiring layer is bonded to the upper surface of the transparent ceramic layer. The lower reflective surface reflects a first light ray, transmitting through the transparent ceramic layer, to the upper surface of the transparent ceramic layer. A method of manufacturing the fully reflective and highly thermoconductive electronic module is also disclosed.