Invention Grant
US08304661B2 Ceramic composite multilayer substrate, method for manufacturing ceramic composite multilayer substrate and electronic component 有权
陶瓷复合多层基板,陶瓷复合多层基板和电子部件的制造方法

Ceramic composite multilayer substrate, method for manufacturing ceramic composite multilayer substrate and electronic component
Abstract:
A high-reliability ceramic composite multilayer substrate that has excellent flatness and few remaining pores, can be produced at a low cost while simplifying the manufacturing process, and can eliminate layer separation or separation from a mother board. The ceramic composite multilayer substrate includes a laminate containing a first ceramic layer and a second ceramic layer that is disposed so as to contact the first ceramic layer and suppresses firing shrinkage in the plane direction of the first ceramic layer. The laminate includes a resin/ceramic composite layer in which porous ceramic is impregnated with a resin formed on at least one principal surface of the laminate.
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