Invention Grant
- Patent Title: Ceramic composite multilayer substrate, method for manufacturing ceramic composite multilayer substrate and electronic component
- Patent Title (中): 陶瓷复合多层基板,陶瓷复合多层基板和电子部件的制造方法
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Application No.: US12787415Application Date: 2010-05-26
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Publication No.: US08304661B2Publication Date: 2012-11-06
- Inventor: Masato Nomiya
- Applicant: Masato Nomiya
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2007-311632 20071130
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H01K3/22

Abstract:
A high-reliability ceramic composite multilayer substrate that has excellent flatness and few remaining pores, can be produced at a low cost while simplifying the manufacturing process, and can eliminate layer separation or separation from a mother board. The ceramic composite multilayer substrate includes a laminate containing a first ceramic layer and a second ceramic layer that is disposed so as to contact the first ceramic layer and suppresses firing shrinkage in the plane direction of the first ceramic layer. The laminate includes a resin/ceramic composite layer in which porous ceramic is impregnated with a resin formed on at least one principal surface of the laminate.
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