Invention Grant
- Patent Title: Resistance measuring device, display panel, and measuring method of bonding resistance
- Patent Title (中): 电阻测量装置，显示面板和粘接电阻测量方法
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Application No.: US12554918Application Date: 2009-09-06
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Publication No.: US08305094B2Publication Date: 2012-11-06
- Inventor: Hsi-Ming Chang
- Applicant: Hsi-Ming Chang
- Applicant Address: TW Bade, Taoyuan
- Assignee: Chunghwa Picture Tubes, Ltd.
- Current Assignee: Chunghwa Picture Tubes, Ltd.
- Current Assignee Address: TW Bade, Taoyuan
- Agent Winston Hsu; Scott Margo
- Priority: TW98116545A 20090519
- Main IPC: G01R27/08
- IPC: G01R27/08
Abstract:
The resistance measuring device of the present invention includes switch transistors and switch conductive lines disposed between the bonding pads on a first substrate and between the bumps on a second substrate, such that the bonding pads and the bumps are conducted when the transistors are turned on, and the bonding resistance between at least one of the bonding pads and its corresponding bump can be directly measured.
Public/Granted literature
- US20100295567A1 Resistance measuring device, display panel, and measuring method of bonding resistance Public/Granted day:2010-11-25
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