Invention Grant
- Patent Title: Wireless communication module
- Patent Title (中): 无线通信模块
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Application No.: US12806689Application Date: 2010-08-19
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Publication No.: US08305285B2Publication Date: 2012-11-06
- Inventor: Jinsik Lee
- Applicant: Jinsik Lee
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2009-0076657 20090819
- Main IPC: H01Q1/48
- IPC: H01Q1/48

Abstract:
Disclosed herein is a wireless communication module, wherein a module substrate provided with components of a communication circuit part for the wireless communication module and having a ground pattern and a power feeding pattern is provided thereon with a shield can type antenna, the shield can type antenna comprises a ground area, a plurality of curved parts formed by downwardly curving both up/down and left/right side surfaces of the ground area, and an antenna part provided at the outer side of the curved part formed at both left/right side surfaces of the ground area.
Public/Granted literature
- US20110043426A1 Wireless communication module Public/Granted day:2011-02-24
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