Invention Grant
- Patent Title: Exposure apparatus, device manufacturing method, and aperture stop manufacturing method
- Patent Title (中): 曝光装置,装置制造方法和孔径光阑制造方法
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Application No.: US12484850Application Date: 2009-06-15
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Publication No.: US08305560B2Publication Date: 2012-11-06
- Inventor: Ken Minoda
- Applicant: Ken Minoda
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA Inc IP Division
- Priority: JP2008-156075 20080616
- Main IPC: G03B27/72
- IPC: G03B27/72 ; G03B27/54

Abstract:
A projection exposure apparatus includes an aperture stop that includes a light attenuation part that is located between a light shielding part and an opening part, and has a transmittance larger than that of the light shielding part and smaller than that of the opening part. A width of the light attenuation part is set within a range from a wavefront splitting period of the wavefront splitting device or a value of Z×tan(arcsin(α))/2 to a length that is five times as long as the wavefront splitting period of the wavefront splitting device, where α is a numerical aperture on an exit side of the wavefront splitting device, and Z is a distance between the focal plane of the wavefront splitting device on the exit side and the aperture stop.
Public/Granted literature
- US20090311636A1 EXPOSURE APPARATUS, DEVICE MANUFACTURING METHOD, AND APERTURE STOP MANUFACTURING METHOD Public/Granted day:2009-12-17
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