Invention Grant
- Patent Title: Surface inspection method and surface inspection apparatus
- Patent Title (中): 表面检查方法和表面检查装置
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Application No.: US13032165Application Date: 2011-02-22
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Publication No.: US08305568B2Publication Date: 2012-11-06
- Inventor: Shigeru Matsui , Masayuki Hachiya
- Applicant: Shigeru Matsui , Masayuki Hachiya
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JP2006-193184 20060713
- Main IPC: G01N21/88
- IPC: G01N21/88

Abstract:
Light from a light source becomes two illumination beams by a beam splitter. The beams are irradiated onto a semiconductor wafer from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots. When the sum of scattered, diffracted, and reflected lights due to the illumination beams is detected, influence of the anisotropy which a contaminant particle and a defect existing in the wafer itself or thereon have with respect to an illumination direction, can be eliminated.
Public/Granted literature
- US20110141461A1 Surface Inspection Method and Surface Inspection Apparatus Public/Granted day:2011-06-16
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