Invention Grant
US08305699B2 Wafer-level lens module with extended depth of field and imaging device including the wafer-level lens module
有权
具有扩展景深的晶片级透镜模块和包括晶片级透镜模块的成像装置
- Patent Title: Wafer-level lens module with extended depth of field and imaging device including the wafer-level lens module
- Patent Title (中): 具有扩展景深的晶片级透镜模块和包括晶片级透镜模块的成像装置
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Application No.: US12873461Application Date: 2010-09-01
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Publication No.: US08305699B2Publication Date: 2012-11-06
- Inventor: Seung-Wan Lee , Woon-Bae Kim , Jeong-Yub Lee
- Applicant: Seung-Wan Lee , Woon-Bae Kim , Jeong-Yub Lee
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2009-0089876 20090923; KR10-2010-0019155 20100303
- Main IPC: G02B9/00
- IPC: G02B9/00

Abstract:
A wafer-level lens module with an extended depth of field (EDF) and an imaging device including the wafer-level lens module are provided. The wafer-level EDF lens module includes a plurality of wafer-scale lenses stacked with fixed distances therebetween. The plurality of wafer-scale lenses includes an effective lens having a profile which satisfies a corrected optimized aspheric function, wherein a profile of a center region of the effective lens is optimized for an infinity-focused image and a profile of an edge region of the effective lens is optimized for a macro-focused image.
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