Invention Grant
- Patent Title: Connecting arrangement for an optical device
- Patent Title (中): 光学装置的连接装置
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Application No.: US12561800Application Date: 2009-09-17
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Publication No.: US08305701B2Publication Date: 2012-11-06
- Inventor: Heiko Methe , Willi Heintel , Sascha Licht
- Applicant: Heiko Methe , Willi Heintel , Sascha Licht
- Applicant Address: DE Oberkochen
- Assignee: Carl Zeiss SMT GmbH
- Current Assignee: Carl Zeiss SMT GmbH
- Current Assignee Address: DE Oberkochen
- Agency: Fish & Richardson P.C.
- Priority: DE102008047741 20080917
- Main IPC: G02B7/02
- IPC: G02B7/02

Abstract:
The disclosure relates to a connecting arrangement for an optical device, such as in microlithography. The connecting arrangement includes a first body, a second body and a connecting device. The first body contacts the second body in a laminar manner in a contact region. The connecting device is connected to the second body and contacts the first body via at least one contact unit. The connecting device is configured to generate a predefinable contact force in the contact region between the first body and the second body. The contact unit includes a plurality of separate contact elements. Each contact element is connected to the second body via a spring unit which can be elastically deformed to generate a contribution to the contact force.
Public/Granted literature
- US20100065252A1 CONNECTING ARRANGEMENT FOR AN OPTICAL DEVICE Public/Granted day:2010-03-18
Information query
IPC分类:
G | 物理 |
G02 | 光学 |
G02B | 光学元件、系统或仪器 |
G02B7/00 | 光学元件的安装、调整装置或不漏光连接 |
G02B7/02 | .用于透镜 |