An LED module for use in sign letter channel lights comprises a substrate, a reflector mounted on the substrate, an LED mounted within the reflector on the substrate and a Zener diode shunt element connected in parallel across the LED, a printed circuit board on the substrate, wherein the LED is mounted on the printed circuit board, and an insulating cover. The module may be entirely encapsulated. An LED driving protection circuit provides ground fault protection for a plurality of series connected LED modules.