Invention Grant
- Patent Title: Heat removal in compact computing systems
- Patent Title (中): 紧凑型计算系统中的散热
-
Application No.: US12620299Application Date: 2009-11-17
-
Publication No.: US08305761B2Publication Date: 2012-11-06
- Inventor: Brett W. Degner , Peteris K. Augenbergs , Frank Liang , Amaury J. Heresztyn , Dinesh Mathew , Thomas W. Wilson, Jr.
- Applicant: Brett W. Degner , Peteris K. Augenbergs , Frank Liang , Amaury J. Heresztyn , Dinesh Mathew , Thomas W. Wilson, Jr.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Womble Carlyle Sandridge & Rice LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K5/00 ; F28F7/00 ; G06F1/20 ; H01L23/10
Abstract:
A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.
Public/Granted literature
- US20110114294A1 HEAT REMOVAL IN COMPACT COMPUTING SYSTEMS Public/Granted day:2011-05-19
Information query
