Invention Grant
- Patent Title: Enclosure of electronic device
- Patent Title (中): 电子设备外壳
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Application No.: US12855903Application Date: 2010-08-13
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Publication No.: US08305774B2Publication Date: 2012-11-06
- Inventor: Yu-Chang Pai , Po-Chuan Hsieh , Chien-Hung Liu , Shou-Kuo Hsu
- Applicant: Yu-Chang Pai , Po-Chuan Hsieh , Chien-Hung Liu , Shou-Kuo Hsu
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99118297A 20100607
- Main IPC: H05K9/00
- IPC: H05K9/00
Abstract:
An enclosure includes a plate. The plate defines a number of through holes. A hollow shield extends from the edges bounding each through hole. A top side of the shield opposite to the plate is smaller than a bottom side of the shield which is connected to the edges of the through hole. The enclosure can better shield electromagnetic interference (EMI) from the electronic device.
Public/Granted literature
- US20110299263A1 ENCLOSURE OF ELECTRONIC DEVICE Public/Granted day:2011-12-08
Information query
