Invention Grant
US08306313B2 Method for placing at least one component provided with connection points on a substrate, as well as such a device
有权
将具有连接点的至少一个部件放置在基板上的方法以及这种装置
- Patent Title: Method for placing at least one component provided with connection points on a substrate, as well as such a device
- Patent Title (中): 将具有连接点的至少一个部件放置在基板上的方法以及这种装置
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Application No.: US12167083Application Date: 2008-07-02
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Publication No.: US08306313B2Publication Date: 2012-11-06
- Inventor: Hubert Francijn Maria Hoogers
- Applicant: Hubert Francijn Maria Hoogers
- Applicant Address: NL Veldhoven
- Assignee: Assembleon B.V.
- Current Assignee: Assembleon B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Foley & Lardner LLP
- Priority: NL1034086 20070703
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
A method for placing at least one component provided with connection points on a substrate. First, positions of the connection points are determined, after which the component is positioned at desired positions on the substrate with the connection points thereof. Upon placement of a number of components, the contour of a component as well as the positions of the connection points relative to said contour are determined for a first number of components. On the basis of the calculated positions of the connection points relative to the contours average positions of the connection points relative to the contour are calculated. Upon placement of a second number of components the contour of a component is determined, whereupon the expected positions of the connection points relative to the contour are calculated on the basis of said average positions.
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