Invention Grant
- Patent Title: Pattern generating method, method of manufacturing semiconductor device, computer program product, and pattern-shape-determination-parameter generating method
- Patent Title (中): 图案生成方法，制造半导体器件的方法，计算机程序产品和图案形状确定参数生成方法
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Application No.: US12683993Application Date: 2010-01-07
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Publication No.: US08307310B2Publication Date: 2012-11-06
- Inventor: Toshiya Kotani , Hiromitsu Mashita , Takafumi Taguchi , Ryuji Ogawa
- Applicant: Toshiya Kotani , Hiromitsu Mashita , Takafumi Taguchi , Ryuji Ogawa
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner , L.L.P.
- Priority: JP2009-017161 20090128
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F19/00 ; G06F17/10 ; G06F7/60 ; G06K9/00
Abstract:
A pattern generating method includes: extracting, from a shape of a pattern generated on a substrate, a contour of the pattern shape; setting evaluation points as verification points for the pattern shape on the contour; calculating curvatures on the contour in the evaluation points; and verifying the pattern shape based on whether the curvatures satisfy a predetermined threshold set in advance.
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