Invention Grant
- Patent Title: Electronic device and manufacturing method thereof
- Patent Title (中): 电子装置及其制造方法
-
Application No.: US12138319Application Date: 2008-06-12
-
Publication No.: US08310027B2Publication Date: 2012-11-13
- Inventor: Christian Russ , Christian Pacha , Snezana Jenei , Klaus Schruefer
- Applicant: Christian Russ , Christian Pacha , Snezana Jenei , Klaus Schruefer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P
- Main IPC: H01L29/73
- IPC: H01L29/73

Abstract:
Embodiments relate to a bipolar transistor that includes a body region having a fin structure. At least one terminal region may be formed over at least a portion of the body region. The at least one terminal region may be formed as an epitaxially grown region. Embodiments also relate to a vertically integrated electronic device that includes a first terminal region, a second terminal region and a third terminal region. The second terminal region may be arranged over at least a portion of the third terminal region, and at least two of the first, second and third terminal regions may be formed as epitaxially grown regions.
Public/Granted literature
- US20090309167A1 Electronic Device and Manufacturing Method Thereof Public/Granted day:2009-12-17
Information query
IPC分类: