A semiconductor apparatus capable of detecting a crack generated in a semiconductor chip while the design freedom, the layout freedom of a wiring, the layout efficiency of LSI, and the layout efficiency of a package substrate are improved. The semiconductor apparatus according to the invention includes a semiconductor chip having a multilayered wiring structure; plural electrode pads being formed on a top surface along the outer periphery of the semiconductor chip; and a wiring being coupled to a first electrode pad and a second electrode pad selected from the plural electrode pads and formed along the entire outer periphery of the semiconductor chip in plan view. The wiring includes a first wiring and a second wiring that are formed on different layers, and the first wiring and the second wiring are connected in series by a connection plug.