Invention Grant
- Patent Title: Package apparatus and method of operating the same
- Patent Title (中): 包装装置及其操作方法
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Application No.: US12774665Application Date: 2010-05-05
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Publication No.: US08310882B2Publication Date: 2012-11-13
- Inventor: Sang Kyu Lee
- Applicant: Sang Kyu Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP&T Group LLP
- Priority: KR10-2009-0047826 20090529
- Main IPC: G11C7/06
- IPC: G11C7/06
Abstract:
A package apparatus includes at least one memory chip, a voltage detection circuit configured to make a determination of whether a voltage supplied to the memory chip is a specific voltage or higher, and a controller configured to control an operation of the memory chip based on a result of the determination.
Public/Granted literature
- US20100302876A1 PACKAGE APPARATUS AND METHOD OF OPERATING THE SAME Public/Granted day:2010-12-02
Information query
