Invention Grant
- Patent Title: Repair fuse device
- Patent Title (中): 维修保险丝装置
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Application No.: US12495562Application Date: 2009-06-30
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Publication No.: US08310888B2Publication Date: 2012-11-13
- Inventor: Seung In Bang
- Applicant: Seung In Bang , Hyung Seok Bang, legal representative , Hyun Koo Choi, legal representative
- Applicant Address: KR Icheon
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Icheon
- Priority: KR10-2008-0088766 20080909
- Main IPC: G11C7/00
- IPC: G11C7/00
Abstract:
A repair fuse device is provided. The repair fuse device remarkably reduces the number of the enable fuse cuttings by making initial states of all repair fuse sets to a repair state, cutting an address fuse corresponding to a defective cell, and cutting an enable fuse corresponding to a defective redundancy cell.
Public/Granted literature
- US20110085396A1 REPAIR FUSE DEVICE Public/Granted day:2011-04-14
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