Invention Grant
- Patent Title: System and method of compensating for device mounting and thermal transfer errors
- Patent Title (中): 补偿装置安装和热转印错误的系统和方法
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Application No.: US12239189Application Date: 2008-09-26
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Publication No.: US08311763B2Publication Date: 2012-11-13
- Inventor: William C. Schuh , David P. Culberston
- Applicant: William C. Schuh , David P. Culberston
- Applicant Address: US MO St. Louis
- Assignee: Watlow Electric Manufacturing Company
- Current Assignee: Watlow Electric Manufacturing Company
- Current Assignee Address: US MO St. Louis
- Agency: Brinks Hofer Gilson & Lione
- Main IPC: G01K15/00
- IPC: G01K15/00

Abstract:
A method of compensating a temperature measurement of a thermal device in a user environment as a function of a thermal transfer of the thermal device in a temperature measurement system. The method includes inputting thermal transfer parameters associated with heat transfer characteristics of the thermal device stored by a thermal transfer indicia. The method further includes measuring a signal of the thermal device during the temperature measurement and compensating the measured thermal device signal as a function of the thermal transfer function based on one of a plurality of predetermined specific thermal environments and one of a plurality of predetermined specific thermal errors associated with the thermal device.
Public/Granted literature
- US20090024348A1 SYSTEM AND METHOD OF COMPENSATING FOR DEVICE MOUNTING AND THERMAL TRANSFER ERRORS Public/Granted day:2009-01-22
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