Invention Grant
US08312407B2 Integration of open space/dummy metal at CAD for physical debug of new silicon
有权
在CAD中集成开放空间/虚拟金属，用于新型硅的物理调试
- Patent Title: Integration of open space/dummy metal at CAD for physical debug of new silicon
- Patent Title (中): 在CAD中集成开放空间/虚拟金属，用于新型硅的物理调试
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Application No.: US13276266Application Date: 2011-10-18
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Publication No.: US08312407B2Publication Date: 2012-11-13
- Inventor: Vijay Chowdhury , Che Ta Hsu , Ada Yu
- Applicant: Vijay Chowdhury , Che Ta Hsu , Ada Yu
- Applicant Address: US CA San Jose
- Assignee: Altera Corporation
- Current Assignee: Altera Corporation
- Current Assignee Address: US CA San Jose
- Agency: Womble Carlyle Sandridge & Rice, LLP
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F19/00 ; G06F11/16 ; H03K19/00 ; H01L25/00 ; G01R31/28
Abstract:
An access pad is used to provide access to a functional block of an integrated circuit (IC) device. The access pad is formed using dummy metal in an open space in a metallization level that is between a top metallization level and a base level on which the functional block is formed in the IC device. The access pad at the metallization level provides a contact to access an underlying circuit of the functional block so that the functional integrity of the functional block of the IC device can be verified during probing.
Public/Granted literature
- US20120032704A1 INTEGRATION OF OPEN SPACE/DUMMY METAL AT CAD FOR PHYSICAL DEBUG OF NEW SILICON Public/Granted day:2012-02-09
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