Invention Grant
US08313892B2 Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device 有权
多层体,抗蚀剂图案形成方法,通过精细加工制造图案的方法和电子装置

  • Patent Title: Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device
  • Patent Title (中): 多层体,抗蚀剂图案形成方法,通过精细加工制造图案的方法和电子装置
  • Application No.: US11050830
    Application Date: 2005-02-07
  • Publication No.: US08313892B2
    Publication Date: 2012-11-20
  • Inventor: Junichi Kon
  • Applicant: Junichi Kon
  • Applicant Address: JP Kawasaki
  • Assignee: Fujitsu Limited
  • Current Assignee: Fujitsu Limited
  • Current Assignee Address: JP Kawasaki
  • Agency: Westerman, Hattori, Daniels & Adrian, LLP
  • Priority: JP2004-171202 20040609; JP2004-337249 20041122
  • Main IPC: G03C1/85
  • IPC: G03C1/85 G03C1/00 G03F7/00
Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device
Abstract:
Technologies to form fine resist patterns consistently by solving the problem of poor patterning influenced by a resist-protecting film, are provided. A layer made of a resist (resist layer) is formed on a substrate, a resist-protecting film comprising an antistatic resin and a photo-acid generating agent is formed on the resist layer, and active-energy rays are selectively irradiated over the resist-protecting film, so that a resist pattern is formed by developing the resist.
Information query
Patent Agency Ranking
0/0