Invention Grant
US08313974B2 Substrate transport method 有权
基板运输方式

Substrate transport method
Abstract:
An embodiment of the substrate transport method of the present invention includes a plasma CVD apparatus (10), a first transport robot (20) that retrieves the plurality of substrates processed by the plasma CVD apparatus (10) one by one, and sequentially storing the substrates in a substrate cassette (30) capable of loading substrates in multiple stages, and a second transport robot (40) that retrieves the substrates from the substrate cassette (3) one by one and transports the substrates to a pre-patterning alignment step (50). The first transport robot (20) sequentially retrieves substrates (1a to 1e) inside a load lock chamber (12) starting with a lowermost stage, and sequentially stores the substrates (1a to 1e) in the substrate cassette (30) starting with an uppermost stage, for example, and the second transport robot (40) sequentially retrieves the substrates (1a to 1e) stored in the substrate cassette (30) starting with the uppermost stage, and transports the substrates (1a to 1e) to the alignment step (50).
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