Invention Grant
US08313981B2 Chip card, and method for the production thereof 有权
芯片卡及其制造方法

Chip card, and method for the production thereof
Abstract:
A chip card in the form of an ID-1 card, a plug-in SIM or a USB token has a layered compound with two or three layers extending over the complete chip card. The chip card including an exterior foil layer has on its outward facing front side a communication contact layout and on its back side a flip chip, as well as a flip chip contact layout which is electroconductively connected with the communication contact layout on the front side.
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