Semiconductor device and method for manufacturing the same

Invention Grant

US08314032B2 Semiconductor device and method for manufacturing the same 失效

Title translation: 半导体装置及其制造方法

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Patent Title: Semiconductor device and method for manufacturing the same
Patent Title (中): 半导体装置及其制造方法
Application No.: US12838451

Application Date: 2010-07-17
Publication No.: US08314032B2

Publication Date: 2012-11-20
Inventor: Tetsufumi Kawamura , Hiroyuki Uchiyama , Hironori Wakana , Mutsuko Hatano , Takeshi Sato
Applicant: Tetsufumi Kawamura , Hiroyuki Uchiyama , Hironori Wakana , Mutsuko Hatano , Takeshi Sato
Applicant Address: JP Tokyo
Assignee: Hitachi, Ltd.
Current Assignee: Hitachi, Ltd.
Current Assignee Address: JP Tokyo
Agency: Miles & Stockbridge P.C.
Priority: JP2009-191589 20090821
Main IPC: H01L21/311
IPC: H01L21/311

Semiconductor device and method for manufacturing the same

Abstract:

A method for manufacturing a thin film transistor (TFT) through a process including back exposure, in which oxide semiconductor is used for a channel layer; using an electrode over a substrate as a mask, negative resist is exposed to light from the back of the substrate; the negative resist except its exposed part is removed; and an electrode is shaped by etching a conductive film using the exposed part as an etching mask.

Abstract(Chinese):

一种通过包括反向曝光的工艺制造薄膜晶体管（TFT）的方法，其中将氧化物半导体用于沟道层; 使用基板上的电极作为掩模，负光刻胶从基板的背面暴露于光; 去除其外露部分的负光刻胶; 并且通过使用暴露部分作为蚀刻掩模蚀刻导电膜来成形电极。

Public/Granted literature

US20110042667A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2011-02-24

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/18	...器件有由周期表Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料
H01L21/30	....用H01L21/20至H01L21/26各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/28）
H01L21/31	.....在半导体材料上形成绝缘层的，例如用于掩膜的或应用光刻技术的（密封层入H01L21/56）；以及这些层的后处理；这些层的材料的选择
H01L21/3105	......后处理
H01L21/311	.......绝缘层的刻蚀