An organosilicon compound is provided comprising an organic functional radical having a photopolymerizable double bond linked to a hydrolyzable radical-bonded silicon atom via a divalent organic radical containing a urea bond. Due to the inclusion of amide, urethane or urea bond structure and a photopolymerizable functional radical, the organosilicon compound has excellent compatibility with resins. The method is capable of preparing the organosilicon compound having a minimal chlorine content.