Invention Grant
- Patent Title: Wiring board for light-emitting element
- Patent Title (中): 发光元件接线板
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Application No.: US13071431Application Date: 2011-03-24
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Publication No.: US08314346B2Publication Date: 2012-11-20
- Inventor: Tomohide Hasegawa , Minako Izumi , Yasuhiro Sasaki , Noriaki Hamada , Takuji Okamura , Koichi Motomura
- Applicant: Tomohide Hasegawa , Minako Izumi , Yasuhiro Sasaki , Noriaki Hamada , Takuji Okamura , Koichi Motomura
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: DLA Piper LLP (US)
- Priority: JP2004-130901 20040427; JP2004-219779 20040728; JP2004-242224 20040823; JP2004-247203 20040826; JP2004-279513 20040927; JP2004-338867 20041124; JP2004-340339 20041125
- Main IPC: H05K1/16
- IPC: H05K1/16
Abstract:
A wiring board for a light-emitting element includes a ceramic insulating substrate, and a conductor layer formed on the surface or in the inside of the insulating substrate, the conductor layer having a mounting region mounting a light-emitting element on one surface of the insulating substrate. The insulating substrate includes a heat-conducting pole-like conductor having a thermal conductivity higher than that of the insulating substrate. The heat-conducting pole-like conductor extends through the insulating substrate in the direction of thickness thereof from the light-emitting element mounting region of the insulating substrate, and is formed by the co-firing with the insulating substrate.
Public/Granted literature
- US20110169037A1 Wiring Board for Light-Emitting Element Public/Granted day:2011-07-14
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