Invention Grant
- Patent Title: Lead pin and wiring substrate with lead pin, and method of manufacturing the same
- Patent Title (中): 带引脚的引脚引脚和布线基板及其制造方法
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Application No.: US12911232Application Date: 2010-10-25
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Publication No.: US08314349B2Publication Date: 2012-11-20
- Inventor: Masakuni Kitajima
- Applicant: Masakuni Kitajima
- Applicant Address: JP Nagano-shi
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2009-254182 20091105
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A lead pin includes a shaft portion, a connection head portion provided to a top end side of the shaft portion, and having a diameter which is larger than a diameter of the shaft portion, wherein the connection head portion includes a bonding surface on an opposite side to the shaft portion side, and the bonding surface includes a flat surface provided in a center part, a convex surface which is provided like a ring shape to an outside of the flat surface and rounded by a radius R like a convex shape, and a concave surface which is provided like a ring shape to an outside of the convex surface and rounded by a radius R like a concave shape.
Public/Granted literature
- US20110103029A1 LEAD PIN AND WIRING SUBSTRATE WITH LEAD PIN, AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-05-05
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