Invention Grant
US08314349B2 Lead pin and wiring substrate with lead pin, and method of manufacturing the same 有权
带引脚的引脚引脚和布线基板及其制造方法

Lead pin and wiring substrate with lead pin, and method of manufacturing the same
Abstract:
A lead pin includes a shaft portion, a connection head portion provided to a top end side of the shaft portion, and having a diameter which is larger than a diameter of the shaft portion, wherein the connection head portion includes a bonding surface on an opposite side to the shaft portion side, and the bonding surface includes a flat surface provided in a center part, a convex surface which is provided like a ring shape to an outside of the flat surface and rounded by a radius R like a convex shape, and a concave surface which is provided like a ring shape to an outside of the convex surface and rounded by a radius R like a concave shape.
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